So I finally got a chance to do a bit more practice this weekend with my reflow controller and modified toaster oven. First of all I highly recommend the Black and Decker Infrawave ovens, they heat fast with quick response which is perfect. The second thing I recommend is making sure you understand the heating profile of the solder paste you use. My first test was a disaster as it turns out I had the wrong profile for the stuff I had gotten locally. After a bit of trial and error, I found a profile that works out well for me. Attached a few pics below, the 100pin chip was SO much easier with the oven. I did have several solder bridges since there was a bit too much paste, but the solder braid/wick cleaned it up nicely. Chip worked too! Though until I cooked it as my board has a bug somewhere, but that's a whole other story...
I think I'm now ready for the SDR-Widget and it's 144pin chip!
Applied the paste
Placed the chup pretty close to where it needs to go
Board baking away for 2.5 minutes
Final result, several blobs, but perfectly lined up! A lot easier than eyeing it the old way...
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